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ASE TECHNOLOGY HOLDING -ADR

ASXNYSE
🏆 #177 by market capEarnings Oct 28US Equity
$39.57 $0.94 (+2.37%)
Live
1h
24h▲ 2.4%
7d▲ 7.6%
14d▲ 25.7%
30d▼ 2.3%
1y▲ 290.6%
🏦Market Cap
$87.00B
Mid Cap
📈Revenue Growth (YoY)
+6.8%
Slowing
📊Gross Margin
19.5%
Thin
💵FCF Margin
-4.4%
Thin
⚖️P/S Ratio
3.8x
Fair
Otter Score
49
Weak

Trading Snapshot

Day Range
$38.95 – $39.89
52-Week Range
$9.52 – $45.52
Volume
$2.46B
Avg Volume
$1.77B
Shares Outstanding
2.20B
Next Earnings
Sep 5, 2026

Fundamentals Snapshot

Annual Revenue
$648.92B
Last Q Revenue
$191.06B
P/E Ratio
44.6
P/S Ratio
3.8x
EPS (TTM)
$27.70
Dividend Yield
1.06%

Why Investors Own ASX

  • High-growth profile — revenue up +34.1% YoY with expanding US Equity exposure.
  • Healthy economics — 58% gross margin and 15% free-cash-flow margin.
  • New products and segments could unlock additional revenue streams.
⚠️ Key Risks

Execution delays, intensifying competition, and valuation compression if growth decelerates.

Financial Trends

Revenue (TTM)
$648.92B +33.0% YoY
Gross Margin (TTM)
57.7% +3.1% YoY
Operating Income (TTM)
$187.54B +33.0% YoY
Free Cash Flow (TTM)
$97.34B +33.0% YoY

About ASE TECHNOLOGY HOLDING -ADR

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

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Otter Score Breakdown

💎Quality
🚀Growth
⚖️Valuation
Momentum
Overall Score
Weak
49/100

Analyst Ratings

Consensus
Buy
26 analysts
Strong Buy9
Buy16
Hold1
Sell0
Strong Sell0
Ratings as of Aug 2026

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