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ASE TECHNOLOGY HOLDING -ADR

ASXNYSE
Earnings Oct 29 Β· PreUS Equity
$44.58β–² $0.66 (+1.51%)
Market closed Β· at close
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24hβ–² 1.5%
7dβ–² 15.2%
14dβ–² 12.8%
30dβ–² 0.3%
ytdβ–² 177.1%
1yβ–² 196.6%
🏦Market Cap
$199.30B
Mid Cap
πŸ“ˆRevenue Growth (YoY)
14.5%
Healthy
πŸ“ŠGross Margin
19.5%
Thin
πŸ’΅FCF Margin
4.5%
Moderate
βš–οΈP/S Ratio
4.0x
Fair
Otter Score
β€”
Insufficient data

Trading Snapshot

Day Range
$42.29 – $44.72
52-Week Range
β€”
Volume (shares)
567,520
Avg Volume (shares)
β€”
Shares Outstanding
4.47B
Next Earnings
2026-10-29

Fundamentals Snapshot

Annual Revenue
$648.92B
Last Q Revenue
$191.06B
P/E Ratio
47.3
P/S Ratio
4.0x
EPS (TTM)
β€”
Dividend Yield
0.80%
Dilution (1yr)
+1.4%
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ASE TECHNOLOGY HOLDING -ADR

ASX
Financial Trends
RevenueThe total money the company brought in from sales, before subtracting any costs.
$648.9Bβ–² +6.8% YoY
Gross MarginOf every $1 of sales, how much is left after the direct cost of making the product/service. Higher = more efficient.
17.7%β–² +15.0% YoY
Operating IncomeProfit from the core business after operating costs, but before interest and taxes. Negative means the core business isn’t profitable yet.
$51.0Bβ–² +24.2% YoY
Free Cash FlowCash left over after running the business and paying for equipment/capex. Negative means the company is burning cash.
βˆ’$20.0Bβ–Ό βˆ’774.8% YoY
Shares OutstandingHow many shares exist. Rising means the company is issuing more shares, which dilutes (shrinks) each existing owner’s slice.
2.23Bβ–² +1.4% YoY
Net CashCash minus total debt. Positive = more cash than debt (financially strong); negative = more debt than cash (net debt).
βˆ’$171.6Bβ–Ό βˆ’$46.7B YoY
StockOtter Β· stockotter.space

About ASE TECHNOLOGY HOLDING -ADR

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

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Otter Score Breakdown

How it's scoredFive components, each rated 1–5β˜… and equally weighted (20%), averaged to a 0–100 score:πŸ’Ž Quality β€” gross marginπŸš€ Growth β€” revenue YoYβš–οΈ Valuation β€” P/S ratio⚑ Momentum β€” 30-day price changeπŸ’§ Dilution β€” 1-yr share issuance (buybacks score higher)

Insufficient data for all five components.

πŸ’ŽQualityβ˜…β˜…β˜…β˜…β˜…
πŸš€Growthβ˜…β˜…β˜…β˜…β˜…
βš–οΈValuationβ˜…β˜…β˜…β˜…β˜…
πŸ’§Dilutionβ˜…β˜…β˜…β˜…β˜…
Overall Score
Insufficient data
β€”/100

Analyst Ratings

β“˜
Consensus
Buy
25 analysts
Strong Buy8
Buy16
Hold1
Sell0
Strong Sell0
Ratings as of Oct 2026

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